Manufacturing Engineer III – Camarillo, CA

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Manufacturing Engineer III
#25-988
<sdf-icon-button _ngcontent-ng-c4503599967738739=”” slot=”after” shape=”circle”></sdf-icon-button> Camarillo, California, United States
Full-Time / Part-Time
Full-Time
Career Level
Experienced Non-Manager
Job Description

Lucix Corporation, a subsidiary of HEICO’s Electronic Technologies Group has steadily evolved to become the world leader in RF Active and Passive Units, Subsystems, and Assemblies, for Commercial, Civil and Defense Satellite Payloads. Lucix also provides RF hardware for Airborne and Ground Systems. All hardware is designed, qualified, manufactured, tested, and shipped from Lucix facilities in California, USA.

We are seeking a versatile, experienced team player in the Operations & Process engineering group of an established provider of RF & Microwave hardware to the global satellite and commercial markets.

Essential Duties and Responsibilities:

  • Act as Manufacturing Engineering representative on Integrated Product Team for one or more projects
  • Evaluate tooling and fixturing needs for new products and repeat orders. Ensure needed items are in place in time to begin production
  • Create shop floor travelers for items on assigned projects
  • Prepare Manufacturing Readiness Review package and present to internal team and customers
  • Review designs for manufacturability within the context of Integrated Product Team
  • Troubleshoot manufacturing difficulties, using lean manufacturing tools. Resolve quickly to resume production
  • Work strategic process improvement projects as background. Able to keep projects moving in the background along with time-critical tactical tasks
Requirements

Job Requirements:

  • BS in engineering or closely related field
  • A minimum of 4 years of related experience in Operations for RF/Microwave products
  • Working knowledge of one of two areas required, both preferred
    • Thin film chip & wire manufacturing materials & processes, including materials and processes for hermetic assembly
    • Printed circuit assembly manufacturing materials & processes
  • Knowledge of Fishbone Diagram, 5 Whys, 8D and other lean tools. Ability to apply efficiently to manufacturing projects as needed.
  • Understanding of AS9100 quality requirements
  • Ability to adapt quickly to new systems
  • Able to manage time commitments of > 1 month
  • Commitment to customer relationships and customer goals
  • Experience with military and/or satellite hardware preferred
Job Details
Pay Range <sdf-tooltip _ngcontent-ng-c4503599967738739=”” attachmentpoint=”right”>Pay Range
The estimated pay range for this job. Disclosing pay information promotes competitive and equitable pay.

The actual pay rate will depend on the person’s qualifications and experience.

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$100,000.00 – $160,000.00 / year
Pay Transparency
In order to support the Fair Compensation Strategy by the US Govt., HR Dept., clients are required to adhere to “Pay Transparency Law”; in the impacted states; that have mandated the employers to list the salary ranges in Job advertisements or postings for job opportunities and Job promotions.

 

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