Technology Consultancy Engineer – (E4)

Job Expectations

The candidate will be part of an engineering services team developing capabilities and solutions to address defect troubleshooting and reduction for the various Applied Materials equipment types used in high volume semiconductor manufacturing.

The deliverables include development of new service capabilities, piloting them with field teams, and then deployment for broader field usage in partnership with internal stakeholders. The team will work with field service engineers and product engineering teams to understand the requirements, bring forward creative ideas, develop proofs-of-concept, and work with application development teams to design, develop, and modify algorithms into production code, provide production support, and train end-users.

Job Summary

Semiconductor industry equipment development or fab manufacturing background with >10 years of experience in at least one or more dielectric deposition, metal deposition, or etch equipment types. Use equipment knowledge to analyze defect issues, curate learnings into knowledge base, collaborate with defect expert system application developers to implement defect troubleshooting capabilities. Knowledge and experience in semiconductor industry with experience in defect troubleshooting methodologies required.

Key Responsibilities

• Collaborate with the Field Service Organization (FSO) resources to understand fab defect troubleshooting methodologies, requirements, & high value problems by equipment types.
• Collaborate with Service Business Units (SBU), Business Units (BU’s) and internal organizations, in support of the defect troubleshooting, defect reduction, and other service offerings.
• Document field requirements for defect troubleshooting by equipment types, perform gap analysis to current application & knowledge base capabilities, and develop capability solution options for the defect expert system development roadmap.
• Build and maintain knowledge bases for multiple equipment types, including review of field and defect incidents and escalations, case studies, and other sources, to curate defect signatures by symptoms and causes, including wafer map, particle image, and element compositions.
• Interact with field and business unit resources on data collection of defect incidents and signatures for NPI equipment, followed by the build and expansion of defect knowledge bases for the new equipment types, which is then followed by releasing the new knowledge bases to the field integrated into the defect expert system application.
• Define, release, and maintain defect troubleshooting tree by equipment types for out-of-control action plans (OCAPs) including the partitioning structure and detailed steps for defect troubleshooting, collaborating with internal business unit and field service product experts.
• Data analysis of equipment installed base and chamber configurations, in addition to service case incidents history, for expansion of defect knowledge bases to new equipment & application types.
• Analyze and develop equipment sensor data based analytics for prioritized defect issue detection, collaborating with the service analytics and digital tools teams
• Develop and maintain training and communications collateral materials for the field deployment of the defect expert system application across new sites and for each new software application release version.
• Travel as needed to regional field offices and conduct training of the defect expert system application to the field resources, and subsequently support the field resources during the deployment pilots.

Requirements

• Knowledge and experience in semiconductor industry, with detailed knowledge of at least one or more types of Applied Materials equipment types in Dielectric Deposition, Etch, or Metal Deposition products, with experience with 2 or more technologies strongly preferred
• Experience in defect troubleshooting methodologies for semiconductor manufacturing equipment
• Experience in data analytics using multiple enterprise data sources and warehouses
• Experience in project management of enterprise solution delivery projects across global cross-functional stakeholder groups
• Experience in leading memory or logic fab, and/or in semiconductor equipment hardware or process engineering development for new product introduction
• Highly organized and detailed-oriented. Ability to build and maintain positive and productive inter-departmental working relationships.
• Ability to work in a cross-functional organization and multitask on multiple projects.
• Drive Subject Matter Experts to deliver programs on time and on budget.
• Excellent oral and written communication, organizational, analytical, and interpersonal skills.
• BS Degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics or Chemistry. Advanced degree in these fields is preferred.

Qualifications

Education:

Bachelor’s Degree

Skills:

Certifications:

Languages:

Years of Experience:

7 – 10 Years

Work Experience:

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 20% of the Time

Relocation Eligible:

No

U.S. Salary Range:

$140,000.00 – $192,500.00

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. 

Read Full Description